Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Viola Eckelt Additional information was obtained by

Additional information was obtained by the 13th Australasian Conference on Information Systems (ACIS)

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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Viola Eckelt Additional information was obtained byBenefiting from Thermal and Mechanical Simulation in Micro Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro electronics; the state of the art methodologies for thermal &